New Delhi: Long-standing rumour is that Apple will ditch the headphone jack in its next iPhone, but latest leaks from a repair shop based in China's Ganzhou suggest otherwise.
China-based Rock Fix has posted photos of the components of the speculated iPhone 7 which continues with the standard headphone jack design but hints at an addition of dual cameras and even a dual SIM tray.
The photos, posted on Chinese microblogging site Weibo, show the upcoming Apple phone 4.7-inch model with a lightning cable assembly which, contrary to earlier rumours, still has the 3.5mm headphone jack attached to it.
Interestingly, some of the recent photos also show the assembly having dual-SIM trays. If true, it would mark a huge shift from Apple's design culture of offering single SIM devices.
Another set of eye-popping features shown off in the images is memory chips of up to 256GB, dual-lens camera for a larger model, and also a change in antenna design. A report on Engadget notes that while the design will be different, there is no likelihood of completely doing away with the antenna bands on the back of the phone. This could be attributed to the rumoured switch to Intel's modem for the GSM models.
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